As a trustworthy electronic PCB assembly manufacturer, Mailin is committed to providing excellent PCB board assembly services for precision electronic devices such as smart ammeters. We understand the importance of smart ammeters in power monitoring and energy management systems, so we focus on ensuring that every PCB board is assembled to the highest accuracy and reliability standards.
Our PCB assembly services cover the entire process from prototype development to mass production. During the design phase, our team of engineers will work closely with customers to ensure that the circuit design fully meets the functional requirements and performance indicators of the smart ammeter. We use advanced EDA (Electronic Design Automation) tools for circuit design to achieve optimized circuit layout and signal integrity.
In the production process of PCB boards, we use automated SMT and DIP assembly lines, as well as sophisticated inspection and testing equipment to ensure that every solder joint and component meets industrial standards. Our quality control team rigorously monitors each assembly step to ensure final product performance and reliability.
In addition, we also provide customized PCBA services, including special material selection, surface treatment and environmental protection options to meet the specific needs of different customers. Our goal is to provide customers with high-quality PCB assembly services that meet their expectations and help their smart ammeter products stand out in the market.
In short, our PCB assembly services focus on providing reliable, precise and customized solutions for critical electronic devices such as smart ammeters. We are committed to becoming our customers' most trusted electronics manufacturing partner through continuous technological innovation and excellent customer service.
dự án SMT
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Mẫu (ít hơn 20 chiếc)
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Lô vừa và nhỏ
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Bảng thẻ tối đa
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Không giới hạn kích thước
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L50*W50mm-L510*460mm
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tấm ván tối đa
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Không giới hạn kích thước
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3mm
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tấm ván tối thiểu
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Không giới hạn kích thước
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0.2mm
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Thành phần chip tối thiểu
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Gói 01005 trở lên
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150mm * 150mm
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Thành phần chip tối đa
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Không giới hạn kích thước
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Độ chính xác vị trí thành phần tối đa 100FP
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Khoảng cách phần chì tối thiểu
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0.3mm
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0.3mm
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khả năng SMT
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Mô hình 50-100
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3-4 triệu điểm/ngày
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Khả năng bổ trợ DIP
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100,000 điểm/ngày
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