As a trustworthy electronic PCB assembly manufacturer, Mailin is committed to providing excellent PCB board assembly services for precision electronic devices such as smart ammeters. We understand the importance of smart ammeters in power monitoring and energy management systems, so we focus on ensuring that every PCB board is assembled to the highest accuracy and reliability standards.
Our PCB assembly services cover the entire process from prototype development to mass production. During the design phase, our team of engineers will work closely with customers to ensure that the circuit design fully meets the functional requirements and performance indicators of the smart ammeter. We use advanced EDA (Electronic Design Automation) tools for circuit design to achieve optimized circuit layout and signal integrity.
In the production process of PCB boards, we use automated SMT and DIP assembly lines, as well as sophisticated inspection and testing equipment to ensure that every solder joint and component meets industrial standards. Our quality control team rigorously monitors each assembly step to ensure final product performance and reliability.
In addition, we also provide customized PCBA services, including special material selection, surface treatment and environmental protection options to meet the specific needs of different customers. Our goal is to provide customers with high-quality PCB assembly services that meet their expectations and help their smart ammeter products stand out in the market.
In short, our PCB assembly services focus on providing reliable, precise and customized solutions for critical electronic devices such as smart ammeters. We are committed to becoming our customers' most trusted electronics manufacturing partner through continuous technological innovation and excellent customer service.
SMT projesi
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Örnek (20 adetten az)
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Küçük ve orta boy toplu
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Maksimum karton
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Boyut sınırı yok
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U50*G50mm-L510*460mm
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maksimum tahta
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Boyut sınırı yok
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3mm
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minimum tahta
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Boyut sınırı yok
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0.2mm
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Minimum çip bileşeni
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01005 paketi ve üzeri
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150mm * 150mm
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Maksimum çip bileşeni
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Boyut sınırı yok
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Maksimum bileşen yerleştirme doğruluğu 100FP
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Minimum kurşun parçası aralığı
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0.3mm
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0.3mm
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SMT yeteneği
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50-100 modelleri
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3-4 milyon puan/gün
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DIP eklenti yetenekleri
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100,000 puan/gün
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Güler yüzlü ekibimiz sizden haber almaktan mutluluk duyacaktır!