As a trustworthy electronic PCB assembly manufacturer, Mailin is committed to providing excellent PCB board assembly services for precision electronic devices such as smart ammeters. We understand the importance of smart ammeters in power monitoring and energy management systems, so we focus on ensuring that every PCB board is assembled to the highest accuracy and reliability standards.
Our PCB assembly services cover the entire process from prototype development to mass production. During the design phase, our team of engineers will work closely with customers to ensure that the circuit design fully meets the functional requirements and performance indicators of the smart ammeter. We use advanced EDA (Electronic Design Automation) tools for circuit design to achieve optimized circuit layout and signal integrity.
In the production process of PCB boards, we use automated SMT and DIP assembly lines, as well as sophisticated inspection and testing equipment to ensure that every solder joint and component meets industrial standards. Our quality control team rigorously monitors each assembly step to ensure final product performance and reliability.
In addition, we also provide customized PCBA services, including special material selection, surface treatment and environmental protection options to meet the specific needs of different customers. Our goal is to provide customers with high-quality PCB assembly services that meet their expectations and help their smart ammeter products stand out in the market.
In short, our PCB assembly services focus on providing reliable, precise and customized solutions for critical electronic devices such as smart ammeters. We are committed to becoming our customers' most trusted electronics manufacturing partner through continuous technological innovation and excellent customer service.
SMT projekt
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Ukázka (méně než 20ks)
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Malá a střední várka
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Maximálně lepenka
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Bez omezení velikosti
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D50*Š50mm-D510*460mm
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maximálně prkno
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Bez omezení velikosti
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3mm
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minimální prkno
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Bez omezení velikosti
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0.2mm
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Minimální složka čipu
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01005 balíček a vyšší
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150mm * 150mm
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Maximální složka čipu
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Bez omezení velikosti
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Maximální přesnost umístění součástek 100FP
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Minimální rozteč vývodových částí
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0.3mm
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0.3mm
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schopnost SMT
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Modely 50-100
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3-4 miliony bodů/den
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Možnosti zásuvného modulu DIP
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100,000 XNUMX bodů/den
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Náš přátelský tým by vás rád slyšel!