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As a leading OEM manufacturer, Mailin specializes in providing green solder mask electronic circuit board (PCBA) assembly services for vehicle inverter systems. Our services are designed to meet the automotive industry's stringent requirements for high performance, high reliability and environmentally friendly manufacturing.
Our PCBA assembly service uses HASL (Hot Air Solder Leveling) surface treatment technology, which is an environmentally friendly and efficient process used to form a uniform solder mask layer on the circuit board. HASL technology not only provides excellent welding performance, but also enhances the corrosion resistance and oxidation resistance of the circuit board, which is crucial for the long-term stable operation of vehicle inverters under various environmental conditions.
During the design and assembly process of the inverter, we pay special attention to the selection of materials and the accuracy of the workmanship. We use high-quality electronic components and advanced assembly equipment to ensure that each solder joint is strong and reliable, thus ensuring the high efficiency and long life of the inverter. In addition, our team of engineers has deep industry knowledge and experience and is able to customize the design and optimization for the special needs of vehicle inverters.
Our quality control process strictly follows ISO standards to ensure that every step from raw material procurement to final product assembly meets the highest quality requirements. Our goal is to provide customers with zero-defect PCBA products, ensuring that the inverter can provide stable and efficient performance under various driving conditions.
In summary, our OEM assembly services provide a solution for vehicle inverters that combines high performance, high reliability and environmentally friendly manufacturing. We are committed to helping customers achieve product optimization and market success through continuous technological innovation and strict quality control.
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SMT project
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Sample(less than 20pcs)
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Small and medium batch
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Maximum card board
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No size limit
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L50*W50mm-L510*460mm
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maximum plank
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No size limit
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3mm
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minimum plank
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No size limit
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0.2mm
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Minimum chip component
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01005 package and above
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150mm*150mm
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Maximum chip component
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No size limit
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Maximum component placement accuracy 100FP
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Minimum lead part spacing
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0.3mm
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0.3mm
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SMT capability
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50-100 models
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3-4 million points/day
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DIP plug-in capabilities
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100,000 points/day
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Our friendly team would love to hear from you!
