As a professional PCBA service provider, Mailin focuses on providing customers with fast and efficient one-stop PCBA manufacturing services. Our service feature is that we can complete the entire process from procurement, assembly to final testing in as short as 72 hours, ensuring that customers can quickly respond to market demand and accelerate product launch time.
Our spray tin surface circuit board process is a proven and mature technology, which not only provides excellent soldering performance and electrical connection stability, but also enhances the corrosion resistance and oxidation resistance of the circuit board . This surface treatment technology ensures that PCBA maintains optimal performance even under extreme temperature and humidity changes in air conditioning systems.
Our manufacturing process uses advanced automated equipment and strict quality control standards. From precision component placement to meticulous welding processes, every step is designed to ensure high product quality and reliability. Our team of engineers has extensive experience and can optimize the design for the special requirements of air conditioning PCBA to improve energy efficiency and system stability.
In addition, our one-stop service also includes professional technical support and customer service, ensuring close communication with customers throughout the entire manufacturing process and timely resolution of any problems that may arise. Our goal is to provide our customers with a worry-free manufacturing experience, helping them stay ahead in a highly competitive market.
In short, our OEM air conditioning PCBA electronic equipment manufacturing services combine quick response, high-quality manufacturing and excellent customer service to provide customers with an efficient, reliable and economical solution. We are committed to becoming our customers' most trustworthy electronics manufacturing partner through continuous technological innovation and process optimization.
SMT project
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Sample(less than 20pcs)
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Small and medium batch
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Maximum card board
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No size limit
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L50*W50mm-L510*460mm
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maximum plank
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No size limit
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3mm
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minimum plank
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No size limit
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0.2mm
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Minimum chip component
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01005 package and above
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150mm*150mm
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Maximum chip component
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No size limit
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Maximum component placement accuracy 100FP
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Minimum lead part spacing
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0.3mm
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0.3mm
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SMT capability
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50-100 models
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3-4 million points/day
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DIP plug-in capabilities
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100,000 points/day
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Our friendly team would love to hear from you!